| 摘要 |
The method comprises the following steps: the transfer of electronic components (10) with active faces to a base (20) carrying electrical contacts (101,102) on one side and connection pads (201,202) on the other side and containing a series of through-connections (301,302) and a series of through-openings (50); the deposition of a deformable film (40) on the faces of electronic components opposite to the active faces; and the suction of deformable film by vacuum effect by use of through-openings (50) so as to envelop the electronic components and form a robust assembly. The transfer of components is effected by the intermediary of metallic solder balls (105,106). The suction is combinned with heating, and is effected with the application of pressure onto the surface of film. The deformable film comprises an adhesive on the side on contact with the faces of electronic components opposite to the active faces. The deformable film is thermoplastic or conducting. The thickness of film is a few tens of micrometres. The encapsulation also includes the deposition of a mineral layer onn the deformable film for hermeticity, and the deposition of a coductor layer for screening. The method also comprises a steep of local cutting of deformable film at least at the level of certain connection pads in a manner to ensure the continuation of electrical contacts. A thick layer of resin is deposited on a flexible film in a manner to ensure a hermetic protection of electronic components. A second deformable film is deposited no the flexible lfilm in a manner to ensure the hermetic protection of electronic components. The second deformable film is of a polymer loaded with conducting mineral particles. The assembly of resin/deformable film/base is cut in a manner to separate the encapsulataed electronic components. |
