Semiconductor device having a semiconductor chip and a lead substrate connected with each other through pads and patterned lead wires without short-circuiting the pads

摘要

A plurality of patterned lead wires equally spaced are arranged on both side ends of a lead substrate, a plurality of pads equally spaced are arranged on both side ends of a semiconductor chip, and the semiconductor chip is mounted on the lead substrate so as to connect the pads of each side end of the semiconductor chip with the patterned lead wires of the corresponding side end of the lead substrate. Widths of the patterned lead wires are smaller than a width of an open space between each pair of pads adjacent to each other in the semiconductor chip, and widths of the pads of the semiconductor chip are larger than a width of an open space between each pair of patterned lead wires adjacent to each other.