| 摘要 |
A method of forming a capacitor. The method includes forming an opening in a substrate, forming an adhesion layer in the opening, and forming a conductive layer in the opening on the adhesion layer. The adhesion layer has a first surface in contact with the substrate, and the conductor has a thickness of less than six hundred angstroms. The method further includes annealing the adhesion layer and the conductor, exposing the first surface of the adhesion layer, forming a dielectric layer on the conductor, and forming a second conductor on the dielectric layer.
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