发明名称 HEAT SHRINKABLE POLYSTYRENE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polystyrene heat shrinkable film capable of being used for a shrink package, shrink-bundled package, shrink label, etc., excellent in low temperature shrinkage, reducing natural shrinkage, being firm, and improving elongation characteristics both in the main shrinking direction of the film and in its right-angled direction. SOLUTION: This heat shrinkable polystyrene film consisting of a mixture of (a) 50-80 wt.% styrene-butadiene block copolymer containing >=85 wt.% styrene, and having >=1.00×10<9> Pa storage elastic modulus (E') at 40 deg.C and one peak temperature of loss elastic modulus (E") at >=30 deg.C and <=80 deg.C, (b) 50-20 wt.% styrene-butadiene block copolymer containing 20-50 wt.% butadiene, and having >=1.00×10<9> Pa storage elastic modulus (E') at 40 deg.C and at least one peak temperature of loss elastic modulus (E") at <=-30 deg.C, and (c) 0-10 wt.% polystyrene resin is characterized by stretching it at least one direction and having >=5% heat shrinkage in a warm water at 70 deg.C in its main shrinking direction for 10 sec.
申请公布号 JP2003155356(A) 申请公布日期 2003.05.27
申请号 JP20020003015 申请日期 2002.01.10
申请人 MITSUBISHI PLASTICS IND LTD 发明人 KOBAYASHI SHUJI;HIRUMA TAKASHI;HONMA YUSUKE;YANARI TOMOKI
分类号 C08J5/18;B29C61/06;B29K25/00;B29K105/02;B29L7/00;C08L53/02;(IPC1-7):C08J5/18 主分类号 C08J5/18
代理机构 代理人
主权项
地址