发明名称 COMPONENT PACK AND COMPONENT PACKAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To realize a component pack and a component packaging device with which the number of kinds of components which can be packaged by the component packaging device can be increased and replacement can be reduced. SOLUTION: The component pack for receiving components to be packaged on a substrate is equipped with a carrier tape on which a plurality of kinds of components are mounted based on a predetermined rule.
申请公布号 JP2003155089(A) 申请公布日期 2003.05.27
申请号 JP20010353100 申请日期 2001.11.19
申请人 YOKOGAWA ELECTRIC CORP 发明人 IINUMA TADAHIKO
分类号 B65D85/86;H05K13/04 主分类号 B65D85/86
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