| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which has a flat surface and hardly causes any trouble to wiring. SOLUTION: This printed wiring board manufacturing method comprises a first step of making a wiring panel 1 equipped with an etching resist layer 5 undergo etching to remove a disused plating layer for forming a wiring layer, a second step of separating and removing the etching resist layer 5 so as to make both ends of a through-hole 2 open, a third step of filling the open through-hole 2 with a thermosetting filling material by screen printing to form a filler 6, and a fourth step of removing a part of the filler 6 protruding from the through-hole 2 by polishing and fixing an insulating layer to the wiring panel 1 by hot pressing for the formation of a multilayer printed wiring board if necessary. |
