| 摘要 |
PROBLEM TO BE SOLVED: To uniformly heat a wafer and rapidly increase/decrease temperature of the wafer and additionally process a large quantity of wafers when heating the wafer installed in a decompression CVD device and an annealing device used for a semiconductor integrated circuit manufacturing process and forming an IC. SOLUTION: This heater comprises a glass type carbon cylindrical body 1 arranged inside a reaction vessel 11 and a high frequency induction coil 2 arranged outside the reaction vessel 11 for heating the wafer 12 inside the reaction vessel 11 by heat-generating the glass type carbon cylindrical body 1.
|
