| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having higher heat transfer efficiency from a semiconductor device to a heat dissipation section and having excellent workability of mounting and demounting of the semiconductor device. SOLUTION: A semiconductor device including a semiconductor device fixed to a heat dissipation section comprises the heat dissipation section having a substantially flat surface, heat transfer means placed on the surface of the heat dissipation section, a heat sink having a substantially flat back surface and placed on the heat transfer means, the semiconductor device including semiconductor elements provided on the heat sink, and fixing means for fixing the semiconductor device to the heat dissipation section. The heat transfer means includes a sheet comprising pressure thermosetting resin and a reformer provided on the opposite sides of the sheet.
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