发明名称 |
WATERPROOF COIL AND METHOD OF FORMING WATERPROOFING INSULATING LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a waterproof coil using a waterproofing insulating layer that has a fixed thin thickness and can be manufactured inexpensively. SOLUTION: This waterproof coil 1 is constituted by coating the whole surface of a coil 2 with the waterproofing insulating layer composed of a thin urethane resin film 3 having a softening temperature lower than the heat- resisting temperature of the insulating coating film of the coil 2 and higher than an ordinary temperature and a waterproofing property. Then the lead-out wire 5 of this coil 1 is led out through a lead-out wire holder 4 fixed to the thin urethane resin film 3. Since the waterproof coil 1 is thus constituted, the external form of the coil 1 becomes compact.
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申请公布号 |
JP2003151819(A) |
申请公布日期 |
2003.05.23 |
申请号 |
JP20010350660 |
申请日期 |
2001.11.15 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LTD |
发明人 |
KOGA SADAMICHI;ITO KENICHI;NAKAHARA TAKASHI;TANAKA MINORU |
分类号 |
H01F41/12;H01F5/06;H02K3/30;H02K15/10;H02K15/12;H02K41/02;(IPC1-7):H01F5/06 |
主分类号 |
H01F41/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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