发明名称 PATTERN-FORMING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: To prepare a mask where dimension errors due to a plurality of causes including backscattering, a Coulomb effect, and a dimension error caused by processes are corrected, to obtain an accurate exposure pattern, and to greatly reduce a data processing time required for correction by an area density map. CONSTITUTION: An exposure pattern is divided into partitioned regions where each influence range of backscattering, a Coulomb effect, and a dimension error caused by processes is considered, a pattern area share (pattern area density) in the partitioned regions is conserved, and exposure is made by a pattern where the amount of pattern deformation is obtained as the function of each pattern area density.
申请公布号 KR20030040074(A) 申请公布日期 2003.05.22
申请号 KR20020069408 申请日期 2002.11.09
申请人 KABUSHIKI KAISHA HITACHI SEISAKUSHO(D/B/A HITACHI, LTD.) 发明人 MURAI FUMIO;FUKUDA HIROSHI
分类号 G03F1/20;G03F1/68;G03F7/20;G06F17/50;H01J37/302;H01L21/027 主分类号 G03F1/20
代理机构 代理人
主权项
地址