发明名称 |
RF circuit assembly |
摘要 |
A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.
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申请公布号 |
US2003095020(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20010992258 |
申请日期 |
2001.11.19 |
申请人 |
SCOLTOCK SUTTON;LIU YAOZHONG;ROSADIUK PAUL;WU SHIH-CHANG;SUYEMATSU HERBERT;FANUCCHI RICHARD |
发明人 |
SCOLTOCK SUTTON;LIU YAOZHONG;ROSADIUK PAUL;WU SHIH-CHANG;SUYEMATSU HERBERT;FANUCCHI RICHARD |
分类号 |
H01P3/08;(IPC1-7):H01P3/08 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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