| 摘要 |
PROBLEM TO BE SOLVED: To prepare a surface protective sheet, in so-called pre-dicing, keeping a constant kerf width during or after grinding the rear of a wafer and easily attaching a releasing tape thereon, and to provide an application method of the sheet. SOLUTION: The surface protective tape is applied in grinding the rear of the wafer, wherein a groove which has shallower cut depth than the thickness of the wafer is formed in the surface of the wafer formed with a semiconductor circuit thereon, the semiconductor wafer is ground from the rear to thin the thickness of the wafer and finally the wafer is divided into separate chips. The tape comprises a substrate and an adhesive layer formed thereon, wherein the substrate has two or more structural layers, the first layer has 10-300μm thickness and 3,000-30,000 N/m<2> Young's modulus and the second layer has <=70 deg.C glass transition point measured by DSC and is formed as the outermost layer. |
