Method of manufacturing probe unit and probe unit manufactured using this method

摘要

A method for producing a probe unit for contacting an electronic circuit such as a wafer or a die having a predetermined pattern of contact pads deployed in a common plane. The method employes a base plate of made of a material capable of surface uplift when irradiated. On the surface of the base plate locations corresponding to said contact pads are determined. Further, the base plate is irradiated at the determined locations by means of a laser. This results in forming conical surface uplifts. The method further includes plating the conical surface uplifts with an electrically conductive material and providing means for electical connection between said plated conical surface uplifts and an external device.