METHOD FOR PACKAGING SEMICONDUCTOR-TYPE GAS SENSOR DEVICE

摘要

PURPOSE: A method for packaging a semiconductor-type gas sensor device is provided to improve the stability of package by using a conductive paste to coupling an electrode pad electrically and mechanically. CONSTITUTION: A ceramic supporting plate(200) is coupled to a metal pin(210) to form a structure. The metal pin(210) is provided with a body(212) and a head unit(214), which is provided on an upper of the body(212). A sensor unit(220) is aligned on the structure. The sensor unit(220) comprises a glass substrate(222), a sensing film(226) provided on an upper of the glass substrate(222), an electrode pad(224), a wiring, and a heater. The electrode pad(224) is used to apply power to the sensing film(226) and the heater. The sensor unit(220) is coupled to the metal pin(210) using a conductive paste.