| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming wiring in which wiring can be formed on a polyimide molding, e.g. a polyimide sheet, at a low cost and a semiconductor integrated circuit or a flexible circuit board employing a polyimide molding to an insulation layer can be produced at a low cost. SOLUTION: A wiring pattern is formed on a polyimide molding by pressing dies 2 and 4 having protrusions 8 and 10 corresponding to wiring against the polyimide molding (a flexible polyimide sheet) 6.
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