| 摘要 |
The invention relates to a device that is used for the hermetic encapsulation of a component that must protected against all stresses. The aforementioned component (5) is fixed to a substrate (15) having a temperature control element (17) glued (16) to the other face thereof. Said assembly is disposed in a case comprising two parts (11, 12) which are assembled by means of gluing (13), with a passage for optical links (6) and electrical connections (18, 142). Said component is supported by elements (19) which project out from one part (11) of the case. A unit (14) is glued to the other part (12) of the case, said unit comprising three-dimensional interconnections which form the temperature regulation electronics. The aforementioned unit, case (11, 12) and a minimum length (L) of the links and connections are encased in a mineral protective layer (4'). In particular, the invention can be used for optoelectronic components and MEMS components. |
