| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board, which can form solder bumps in uniform heights at the end faces of metallized via conductors without dispersion in the diameters of the end faces of the metallized via conductors exposed to the upper face of an insulating substrate. SOLUTION: Ceramic green sheets 11a and 11b for insulating substrate 1 are arranged. The method is provided with a step for making multiple through holes H for disposing the metallized via conductors 2 on the ceramic green sheet 11a by punching, a step for filling the through holes H with metal paste 12 from the punching termination face sides of the through holes H, a step for burning it and obtaining the insulating substrate 1 where the metallized via conductors 2 are disposed in the through holes H, and a step for making the solder bumps 6 on the end faces of the metallized via conductors 2 exposed to the surface of the punching start face sides of the through holes H in the insulating substrate 1. Since the diameters of the end faces to which the metallized via conductors 2 are exposed are almost uniform, the solder bumps 6 in the almost uniform heights can be formed on the end faces.</p> |
