| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that can prevent a substrate from being contaminated with impurities. SOLUTION: The substrate treatment apparatus comprises treatment sections G3 to G5 that have retention bodies 37 for retaining a wafer W to carry out prescribed treatment, a portable box 20 that has an opening where the retention body 37 can be loaded and unloaded and can form a closed space for accommodating the wafer W, and a conveyance mechanism for carrying the box 20 into and out of the treatment sections G1 to G5. In this manner, when the wafer W is conveyed, the wafer W is accommodated in the accommodation box 20. Additionally, when the prescribed treatment is made at the treatment sections G1 to G5, the wafer W may not be carried out of the box 20, and the adhesion of impurities such as oxygen and moisture in the atmosphere to the wafer W can be prevented. |
