| 摘要 |
PROBLEM TO BE SOLVED: To provide a visual inspection device and a visual inspection method for electronic component capable of reducing the size (saving space) of a facility and inspecting the outline of an electronic component more accurately. SOLUTION: The visual inspection device is provided with a feeder feeding chip components 11, a transparent disc 2 conveying the chip components 11 from the feeder, an image pickup part 6 picking up images of the conveyed chip components 11, and a sorting mechanism sorting the chip components 11 on the basis of quality grades of the chip components 11 determined from pieces of image data picked up by the image pickup part 6. In the image pickup part 6, two cameras 17a and 17b with optical axes facing each other are provided on both sides of each conveyed chip component 11, and illuminating parts 18a and 18b arranged in positions where illuminating light does not enter a visual field of each camera 17a and 17b and illuminating the chip components 11 are provided in regard to each camera 17a and 17b.
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