| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for coat processing for formation of a film improved in a uniformity of the film thickness over the whole surface of the substrate. SOLUTION: In a coat processing unit 11 in this apparatus, there are provided a spin chuck 71 for holding a wafer W nearly horizontally, a motor 72 for rotating the spin chuck 71, a nozzle 81 for discharging coating liquid nearly in the center of the wafer W, and a pre-wet nozzle 81a for discharging a thinner having a high coating liquid wettability to the wafer W in a predetermined position between the center of the wafer W and the peripheral edge. The thinner is discharged for a pre-wet treatment on the peripheral part of the wafer W, and the coating liquid is discharged on about the center of the surface of the rotating wafer W. The coating liquid is spread all over the surface of the wafer W, forming an improved film of a uniform thickness. |
