发明名称 Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
摘要 The present invention provides an acoustic transducer, or an array of such transducers, formed on a single integrated circuit chip, and a method of making the same, in which there is included an array of acoustic transducers, each capable of detecting an acoustic signal and generating a transducer signal, and including a first and second electrode with a void region disposed between the first and second electrode, and at least one signal line associated with one of the first and second electrodes. Disposed below the array of acoustic transducers is a plurality of amplifiers and other circuit components, such that each of the plurality of amplifiers is coupled to one of the signal lines associated with one of the acoustic transducers and is capable of amplifying the associated transducer signal to obtain an amplified transducer signal on an amplifier output signal line.
申请公布号 US6562650(B2) 申请公布日期 2003.05.13
申请号 US20010823412 申请日期 2001.03.29
申请人 SENSANT CORPORATION 发明人 LADABAUM IGAL
分类号 H04R17/00;B06B1/02;H04R23/00;(IPC1-7):H01L21/00;H01L41/04;H01L41/08;H01L41/18 主分类号 H04R17/00
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