| 摘要 |
PROBLEM TO BE SOLVED: To provide hole-filling material with which through-holes, etc., can be filled easily and which is easily polished after it is cured, and to provide a printed wiring board with filled holes which does not have recessed, cracks, etc., in cured resin parts filled in the holes, has superior solder-resistant properties, does not have the corrosion of metal parts, etc., and, as a result, enables the manufacturing of a highly reliable and long life electric product in which a short circuit, a defective electrical connection, etc., are not produced. SOLUTION: This hole-filling material contains (I) liquid epoxy resin, (II) epoxy monomer, (III) curing agent, and (IV) fillers. |
