METHOD FOR METAL PLATING OF POLYAMIDE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a polyimide resin composition enabling direct application of a metal plating to the surface coated with the polyimide resin. SOLUTION: A homogeneously dissolved composition composed of (A) a polyimide having an acid group and soluble in organic solvent and (B) a compound having ethyl vinyl ether groups thermally crosslinkable with the acid group of the component A and bonded to both terminals of a polybutadiene is applied to a substrate and dried. The obtained coating film is treated with an etching liquid containing 100-440 g/L, preferably 200-400 g/L of chromium trioxide and 100-450 g/L, preferably 200-400 g/L of 98% sulfuric acid to dissolve exclusively the butadiene skeleton of the polyimide composition and chemically roughen the coating surface to enable the electroless plating with metal. A metallizable photosensitive polyimide resin composition is produced by adding a photosensitizing agent to the composition of A and B.