| 摘要 |
<p>A phenolic resin or epoxy resin useful as a resin for semiconductor encapsulation materials, which gives a cured composition having an excellent balance among heat resistance, moisture resistance, crack resistance, and moldability. The phenolic resin is one which is obtained by reacting a phenol with an unsaturated cyclic hydrocarbon compound having two or more carbon-carbon double bonds in the presence of an acid catalyst and has a number-average molecular weight of 320 or lower in terms of polystyrene, and in which the content of monofunctional components having only one phenolic hydroxy group per molecule is 2 to 20 wt.%, excluding 2 wt.%, based on the resin.</p> |
