| 摘要 |
<p>A method and an apparatus for performing cascade control of processing of semiconductor wafers (105). A first semiconductor wafer (105) for processing is received, A second semiconductor wafer (105) for processing is received. A cascade processing operation upon the first and the second semiconductor wafers (105) is performed, wherein the cascade processing operation comprises acquiring pre-process metrology data related to the second semiconductor wafer (105) during at least a portion of a time period wherein the first semiconductor wafer (105) is being processed.</p> |
