| 摘要 |
PROBLEM TO BE SOLVED: To avoid the elution of metals into plating baths or their abnormal depositions onto ceramic parts in electronic members made of various ceramic materials without deteriorating the solder-wettability. SOLUTION: An NH3 <+> -free plating bath containing a complexing agent selected from a stannous ion such as of stannous sulfamate gluconic acid, a gluconate and a gluconolactone, a predetermined quaternary ammonium and 500 mol/m<3> K<+> or Na<+> is prepared, and its pH is adjusted to 6.0 to 10.0. The plating bath is used for tin-plating an electrode 2 of the ceramic electronic member to form a plated film 3.
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