| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a ceramic member for a semiconductor manufacturing apparatus, in which a new cleaning method is adopted instead of the conventional wet cleaning method so that the ceramic member can be cleaned only by a dry cleaning method. SOLUTION: Since a step to clean the ceramic member by jetting solid particles of carbon dioxide toward the surface of the ceramic member and a step to clean the ceramic member by heat-treating it in a furnace are combined in this method, contaminants not only on the surface but also on the inside of the cleaned ceramic member can be removed more sufficiently and the cleaning cycle of the ceramic member can be prolonged in comparison with the conventional method in which a wet cleaning step and a heat-cleaning step are combined. The cleaning time in the case of cleaning the ceramic member by jetting the solid particles of carbon oxide can be made shorter drastically than that in the conventional wet cleaning method.
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