发明名称 |
Method for attaching web based polishing materials together on a polishing tool |
摘要 |
A method and apparatus for thermally attaching web-based polishing pads in a chemical-mechanical planarization (CMP) system. Specifically, one end of a first web-based polishing pad and an end of a second web-based polishing pad are inserted in a thermal sealing unit. The ends of the polishing pads are brought into contact with each other and secured in place within the thermal sealing unit. A heating element within thermal sealing unit is activated, thereby fusing the polishing pads.
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申请公布号 |
US6557608(B2) |
申请公布日期 |
2003.05.06 |
申请号 |
US20020254994 |
申请日期 |
2002.09.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BARTLETT AARON T.;HENDERSON GARY O. |
分类号 |
B24B37/04;B24D13/14;B24D18/00;(IPC1-7):B65H21/00;C23F1/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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