Pick-and-place device of CPU socket

摘要

A pick-and-place device includes a substantially rigid board having a bottom face positionable and releasably attachable to a surface of a socket connector in which a plurality of passages are defined. The rigid board covers a first group of the passages with a second group of the passages not covered by the board. Openings are defined in the board to expose some of the passages of the first group for enhancing heat transfer. A solid portion of the rigid board forms a top face of the board for vacuum handling purposes. A flexibe, thin film has a first surface on which adhesive is coated for attaching the film to socket connector and covering both the passages of the second group and the exposed passages of the first group for shielding the passages against contaminants. The film partially overlaps and is adhesively attached to the top face of the board and has an opposite second surface exposed for vacuum handling of the socket connector. The film is thin and thus has no significantly adverse effect on heat transfer.