| 摘要 |
<p>PROBLEM TO BE SOLVED: To leave no trace of adhesive on chips and to prevent cracking or damage of ultrathin chips in the process of peeling protecting sheets from circuit pattern surfaces. SOLUTION: The chips C after dicing are stuck to a ring frame F through the intermediary of an adhesive sheet S, and a protecting sheet S1 is stuck to the circuit pattern surfaces of the chips C. The chips C, together with the ring frame F, are adsorbed to and held on the table 27 of the protecting sheet peeling device 20. A feeder 21 for an adhesive tape T is provided in the vicinity of a table 24, and the adhesive tape T is fed and stuck on the protecting sheet S1. When the adhesive T is drawn for peeling the protecting sheet S1 from the circuit pattern surfaces, the peeling starts at the angle C1 of a chip C or from a position diagonal to the same.</p> |
