SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To improve the quality of a surface to be worked. SOLUTION: A multi-cavity molded base board 7 segmented from a board base 18 is prepared so that an acute angle or obtuse angle can be formed from a glass fiber weaving direction 7d and a cross section extending direction 17 and in a dicing process using a number of the boards 7 after batch molded. The multi-cavity molded base board 7 is diced so that the acute angle or obtuse angle can be formed from the glass fiber weaving direction 7d and the cutting direction 16 on a number of the boards 7. Thus, during or after dicing, glass fibers can be prevented from being dropped from the cross section of a number of the boards 7 and the form of the cross section of a package substrate can be stabilized.