发明名称 ELECTRIC CONNECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To operate a rubbing operation on the electrode of a semiconductor device. SOLUTION: An electric connection device includes a lattice-like frame having a plurality of openings in crossing first and second directions, a probe sheet which has a plurality of probe elements for respective openings and is arranged in one face of the frame so that the probe elements are positioned in parts corresponding to the openings and a sheetlike rubber material arranged in the openings. The probe sheet is disposed on the rubber material or the frame in a region except for the probe elements in such a way that the probe elements extend in a cantilever beam shape so that they can independently deform.
申请公布号 JP2003124273(A) 申请公布日期 2003.04.25
申请号 JP20010320790 申请日期 2001.10.18
申请人 MICRONICS JAPAN CO LTD 发明人 HASEGAWA YOSHIE;KUNIYOSHI SHINJI
分类号 G01R31/26;G01R1/073;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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