发明名称 |
ELECTRIC CONNECTION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To operate a rubbing operation on the electrode of a semiconductor device. SOLUTION: An electric connection device includes a lattice-like frame having a plurality of openings in crossing first and second directions, a probe sheet which has a plurality of probe elements for respective openings and is arranged in one face of the frame so that the probe elements are positioned in parts corresponding to the openings and a sheetlike rubber material arranged in the openings. The probe sheet is disposed on the rubber material or the frame in a region except for the probe elements in such a way that the probe elements extend in a cantilever beam shape so that they can independently deform.
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申请公布号 |
JP2003124273(A) |
申请公布日期 |
2003.04.25 |
申请号 |
JP20010320790 |
申请日期 |
2001.10.18 |
申请人 |
MICRONICS JAPAN CO LTD |
发明人 |
HASEGAWA YOSHIE;KUNIYOSHI SHINJI |
分类号 |
G01R31/26;G01R1/073;H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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