| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a wiring layer which is superior in electric reliability and has high precision and high density, in a multilayer printed wiring board using prepreg wherein a glass cloth is impregnated with insulating resin as an insulating layer, and to provide a method for manufacturing the wiring board. SOLUTION: The prepreg wherein a glass cloth 14 is impregnated with insulating resin 15 in which filler is mixed and a copper foil are laminated, thereby forming an insulating layer 21 and a surface layer copper foil 22 on a wiring board 10 in which first wiring layers 12 are formed on both surfaces of an insulating board 11. A surface layer copper foil aperture part 23 is formed by patterning the surface layer copper foil, and a laser beam is cast through the aperture part 23, thereby forming a hole 16 for a via hole which has a glass cloth protruding part 14a. After desmearing and treatment for obtaining conductivity, a viahole 17 and a conductor layer 18 are formed by electroplating of copper. A second wiring layer 31 is formed by patterning, and a solder resist protecting layer 14 is formed, thereby obtaining the multilayer printed wiring board 100. |
