发明名称 |
TRANSFER FILM OF ELECTRONIC PART METAL FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a plastic film on which a metal film used for forming the electrode of an electronic part by transferring is formed or an electronic part metal film transfer film which is equipped with the plastic film that can be easily released from a metal film or a patterned release layer which is much improved in shape transfer accuracy. SOLUTION: A release layer and a metal film are formed in this sequence on a plastic film having a primer coat layer for the formation of an electronic part metal film transfer film.
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申请公布号 |
JP2003124050(A) |
申请公布日期 |
2003.04.25 |
申请号 |
JP20010313721 |
申请日期 |
2001.10.11 |
申请人 |
TOYO METALLIZING CO LTD |
发明人 |
TAMURA SHINICHI;TOGO HIROSHI;SUZUKI MASARU;KOBAYASHI SHIYUKURO |
分类号 |
B32B7/06;B32B15/08;H01G4/12;(IPC1-7):H01G4/12 |
主分类号 |
B32B7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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