发明名称 TRANSFER FILM OF ELECTRONIC PART METAL FILM
摘要 PROBLEM TO BE SOLVED: To provide a plastic film on which a metal film used for forming the electrode of an electronic part by transferring is formed or an electronic part metal film transfer film which is equipped with the plastic film that can be easily released from a metal film or a patterned release layer which is much improved in shape transfer accuracy. SOLUTION: A release layer and a metal film are formed in this sequence on a plastic film having a primer coat layer for the formation of an electronic part metal film transfer film.
申请公布号 JP2003124050(A) 申请公布日期 2003.04.25
申请号 JP20010313721 申请日期 2001.10.11
申请人 TOYO METALLIZING CO LTD 发明人 TAMURA SHINICHI;TOGO HIROSHI;SUZUKI MASARU;KOBAYASHI SHIYUKURO
分类号 B32B7/06;B32B15/08;H01G4/12;(IPC1-7):H01G4/12 主分类号 B32B7/06
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