| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board using interlayer connection which can cope with height irregularity of a wiring pattern, connect a desired wiring pattern, does not need a cover film and a plating process, and cope with thinner wiring. SOLUTION: In the multilayer wiring board, at least one of the two boards having wiring patterns has a rear electrode, a part between protruded wiring patterns which are necessary to be connected are interlayer-connected via conductive particles, a part between wiring patterns which are not protruded and a part between adjacent patterns are insulated, and the two boards are formed in an unified body by using adhesive agent. In an interlayer connection part constituted of the conductive particles, through hole parts and wiring pattern parts which are formed in the boards exist mixedly. |
