发明名称 |
METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS |
摘要 |
A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface. |
申请公布号 |
WO03033764(A2) |
申请公布日期 |
2003.04.24 |
申请号 |
WO2002US30444 |
申请日期 |
2002.09.25 |
申请人 |
ATOTECH DEUTSCHLAND GMBH;JOSHI, NAYAN, H. |
发明人 |
JOSHI, NAYAN, H. |
分类号 |
C23C18/22;C23C18/28;C23C18/30;H05K3/18 |
主分类号 |
C23C18/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|