发明名称 METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS
摘要 A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
申请公布号 WO03033764(A2) 申请公布日期 2003.04.24
申请号 WO2002US30444 申请日期 2002.09.25
申请人 ATOTECH DEUTSCHLAND GMBH;JOSHI, NAYAN, H. 发明人 JOSHI, NAYAN, H.
分类号 C23C18/22;C23C18/28;C23C18/30;H05K3/18 主分类号 C23C18/22
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