| 发明名称 |
Multilayer RF amplifier module |
| 摘要 |
An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.
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| 申请公布号 |
US2003076659(A1) |
申请公布日期 |
2003.04.24 |
| 申请号 |
US20010041863 |
申请日期 |
2001.10.22 |
| 申请人 |
MICRO MOBIO CORPORATION |
发明人 |
ICHITSUBO IKUROH;WANG GUAN-WU |
| 分类号 |
H01L23/13;H01L23/498;H01L23/66;H05K1/00;H05K1/16;(IPC1-7):H05K1/00 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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