Process for manufacturing substrates with patterned metallizations and holding and fixing element used in the process

摘要

In a first process for structuring the metallisation (4) of at least two substrates (1,2), the two substrates are releasably and tightly connected to each other on one surface by a holding or fixing component (6). The metallisations are then structured on the exposed surface of the substrates. The substrates include at least one insulating layer (3) on the side with the metallisation to be structured. The metallisation is preferably in the form of a metal film on the insulating layer. The insulating layer may be a ceramic layer (3) or a layer of plastics. An Independent claim is included for a holding or fixing component.