| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a package size cannot be further miniaturized in a package structure where a compound semiconductor chip sticks to the island of a punching frame and is subjected to resin molding. SOLUTION: A ship is stuck onto an insulating substrate, and CSP is achieved. The CSP has a radiation shape where a conductive pattern is extended from the lower portion of the chip to an external connection electrode. In this case, the distance from the chip to a post can be shortened, thus decreasing an inductance constituent, improving insertion loss characteristics, and reducing costs. If it is a switch circuit device, a structure for breaking an RF content by a lead connected to the GND can be achieved, thus improving the isolation and high-frequency characteristics. |
