| 摘要 |
PURPOSE: A stack package and its manufacturing method are provided to apply a chip having a dual pad to a dual stack package and a 4 stack package. CONSTITUTION: A chip is provided. The chip is connected to a lead frame with a metal wire. The chip and a metal lead are attached with an adhesive tape for connection. The chip, the metal lead, the metal wire(Au), and the adhesive tape are sealed with encapsulant for protection. These leads are exposed to connect the bottom/top of an upper/lower package to the outside. The leads are attached with adhesive. A chip selector of the lower package, voltage, and a lead frame inner lead of a ground pin are modified for package.
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