| 摘要 |
A die bonder, to which semiconductor pellets 4 are supplied in an arranged state, comprises a substrate feeding mechanism for feeding a substrate 1 including a plurality of pellet islands to successively set the pellet island at a bonding position BP, a defective substrate detecting means 3 for detecting defective pellet island, and a pellet transfer mechanism. The pellet transfer mechanism successively picks up and carries a defective pellet to the bonding position BP for mounting when a pellet island of the substrate set at the bonding position is non-defective, and mounts a defective pellet 4a when a pellet island is defective. In this arrangement, when the defective substrate detecting means determines that a pellet island is defective, a defective pellet is mounted.
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