| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism in which misalignment of contact position is adjusted following the heat deformation of the board even if it happens while processing a board. SOLUTION: The mechanism is to position a plurality of contacts 8a, 8b electrically connecting the wirings 2x1 to 2xm and 3y1 and 3yn with exterior units for the board 1 on the surface of which are formed a plurality of wirings 2x1 to 2xm and 3y1 to 3yn. The plurality of the contacts 8a, 8b are interlinked with metal linking members 6a, 6b and heaters 7a, 7b are arranged as means of changing the interval between the contacts 8a, 8b in accordance with the change of intervals between the wirings due to the heat deformation of the board 1. By adjusting the temperature of the metal of the linking members 6a, 6b, the interval between the contacts 8a and 8b is changed.
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