| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that simultaneous switching noise and EMI noise are increased in a multilayer interconnection board for mounting electronic components that operate at a high speed. SOLUTION: A multilayer interconnection board 1 supplies power via built-in capacitors that are formed by oppositely arranging an internal power wiring layer or ground wiring layers 4 to 6 and 7 to 9 in semiconductor devices 11a and 11b that are mounted onto the upper surface of an insulating board 2 with insulating layers 2c, 2d, 2f and 2g in between. In this case, a plurality of built-in capacitors having different resonance frequencies in a range from each operating frequency band of the semiconductor devices 11a and 11b to the frequency band of harmonic components are connected in parallel. At the same time, a synthetic impedance value at an antiresonance frequency that is generated among the different resonance frequencies is set to a specific value or less. The small frequency band of the synthetic impedance value is widened, and the resonance frequency can be set arbitrarily, thus reducing simultaneous switching noise and EMI noise. |
