发明名称 SOLID ELECTROLYTIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor free from being damaged since an undesired external force given to the capacitor contained therein is suppressed when bonding a substrate or mounting a part on a printed board which contains a solid electrolytic capacitor. SOLUTION: The solid electrolytic capacitor stored in an insulative resin substrate comprises a valve metal substrate having a roughened surface on which an insulative oxide film is formed, at least an insulative oxide film, a solid high polymer electrolytic layer, and a conductive layer sequentially formed on the foil-shaped valve metal substrate. An area in the vicinity of an end of the valve metal substrate having a smooth surface is bonded to an area in the vicinity of an end of the valve metal substrate having a roughened surface such that they are electrically connected, and an area in the vicinity of an end of a conductive metal substrate is bonded to an area in the vicinity of the other end the valve metal substrate having a smooth surface such that they are electrically connected to form a positive electrode. A reinforcing material is disposed in a space in which the solid electrolytic capacitor is stored.
申请公布号 JP2003109877(A) 申请公布日期 2003.04.11
申请号 JP20010299157 申请日期 2001.09.28
申请人 TDK CORP 发明人 KOBAYASHI MASAAKI;NANBA NORIYOSHI
分类号 H01G9/08;H01G9/004;H01G9/04;(IPC1-7):H01G9/08 主分类号 H01G9/08
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