| 摘要 |
The invention relates to a testing arrangement which comprises a connection (2) to be tested comprising one or more analogue components (11, 12). According to the invention, to test one or more analogue components of the connection (2) the testing arrangement comprises a Boundary Scan-type digital component (21) which comprises one or more contact elements (31 to 33), and through one or more contact elements, the Boundary Scan digital component (21) is connected to the connection (2) being tested so that by means of an internal digital Boundary Scan control line (41) of the Boundary Scan digital component (21) and controlled by a controller (51) in the testing arrangement, a voltage-level control according to a digital logic value can be provided in at least one location to the connection (2) being tested comprising one or more analogue components. The arrangement also comprises a measuring instrument (60) which measures the connection (2) being tested comprising one or more analogue components and the Boundary Scan-type digital component connected to it, for the purpose of measuring the impact of the voltage-level control directed to the connection being tested. The arrangement further comprises a means (70) for analysing the measurement information of the measuring instrument (60), which determines a testing result concerning one or more analogue components of the connection on the basis of the measurement information of the measuring instrument (60).
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