发明名称 Plating bath and method for depositing a metal layer on a substrate
摘要 A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.
申请公布号 US2003066756(A1) 申请公布日期 2003.04.10
申请号 US20010971300 申请日期 2001.10.04
申请人 SHIPLEY COMPANY, L.L.C. 发明人 GABE DAVID R.;COBLEY ANDREW J.;BARSTAD LEON R.;KAPECKAS MARK J.;REDDINGTON ERIK;SONNENBERG WADE;BUCKLEY THOMAS
分类号 C25D3/02;C25D3/38;C25D17/10;H05K3/24;(IPC1-7):C25D3/56;C25D3/00;C25D3/10;C25D3/12;C25D3/26;C25D3/46;C25D3/48;C25D3/50;C25D3/58;C25D3/60;C25D3/62 主分类号 C25D3/02
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