| 发明名称 |
Lead-free solder alloy powder paste use in PCB production |
| 摘要 |
<p>Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.</p> |
| 申请公布号 |
GB2352200(B) |
申请公布日期 |
2003.04.09 |
| 申请号 |
GB20000026708 |
申请日期 |
2000.02.16 |
| 申请人 |
* MULTICORE SOLDERS LIMITED |
发明人 |
HECTOR ANDREW HAMILTON * STEEN |
| 分类号 |
B23K1/00;B23K35/02;B23K35/14;B23K35/26;B23K101/42;C22C12/00;C22C13/00;C22C13/02;H05K3/34;(IPC1-7):B23K35/02 |
主分类号 |
B23K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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