发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a new resin composition and its hardened product containing a polycarboxylic acid resin, to provide a photosensitive resin composition in which high resolution can be obtained, and particularly, to provide a color photosensitive resin composition in which high resolution can be obtained even when a pigment having a small particle size is used in high concentration. SOLUTION: [1] The resin composition contains a reaction product of (a) an epoxy compound having at least two or more epoxy groups in the molecule and (b) a polybasic carboxylic acid. [2] The epoxy compound (a) having at least two or more epoxy groups in the molecule of the resin composition described in [1] is expressed by formula (1). In the formula, each of R<1> and R<2> independently represents a hydrogen atom, an alkyl group or a halogen atom, X represents a single bond, ketone group, sulfonate group, methylene group or the like, R<3> represents an alkylene group, R<4> represents a hydrogen atom, an alkyl group or a glycidyl group, m is an integer 0 to 5, and n is an integer 0 to 10.
申请公布号 JP2003107693(A) 申请公布日期 2003.04.09
申请号 JP20010296389 申请日期 2001.09.27
申请人 SUMITOMO CHEM CO LTD 发明人 NAKAI HIDEYUKI;MURO SEIJI
分类号 G03F7/027;C08F290/06;C08G59/14;G02B5/00;G02B5/20 主分类号 G03F7/027
代理机构 代理人
主权项
地址