CIRCUIT WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of discoloration on the surface of an electroless plating metallic layer. SOLUTION: The circuit wiring board 4 constituted by forming a circuit wiring conductor 2 consisting of a high melting point metal on an insulator 1 and depositing an electroless plating metallic layer 6 on the surface of the conductor 2 is so formed that the electroless plating metallic layer 6 contains a group IB element 8 therein and does not contain lead and that the concentration of the group IB element 8 is made higher on the conductor 2 side of the electroless plating metallic layer 6 and lower on the surface side.