I/O TERMINAL AND PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide an I/O terminal and a semiconductor package employing it in which the size and thickness can be reduced and transmission loss can be reduced at the time of inputting/outputting a high frequency signal of 20 GHz or above while ensuring required strength. SOLUTION: At a part of a planar section 4 where line conductors 2 are exposed, first through conductors 6a are provided at intervals 8 each having a quarter of the wavelength of a high frequency signal or less such that a coplanar ground conductor 3 and a ground conductor 3c on the lower surface of the planar section 4 are connected and arranged in the direction substantially parallel with the line direction. At a part of the planar section 4 bonded with a standing wall part 5, second through conductors 6b are provided at the intervals 8 each having a quarter of the wavelength of a high frequency signal or less such that the ground conductor 3c on the upper surface of the standing wall 5 and the ground conductor 3b on the lower surface of the planar section 4 are connected through the coplanar ground conductor 3 and arranged in the direction substantially parallel with the line direction. The interval 8a between the second through conductor 6b and the adjacent side face of the standing wall part 5 substantially perpendicular to the line direction is not larger than one eighth of the wavelength of a high frequency signal.